PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD8L SOIC .150in0508Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0780
MCP2551T-I/SN |
RFQ for MCP2551T-I/SN |
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| Technical/Catalog Information | MCP2551T-I/SN |
| Vendor | Microchip Technology |
| Category | Integrated Circuits (ICs) |
| Number of Drivers/Receivers | 0/1 |
| Type | Transceiver |
| Voltage - Supply | 4.5 V ~ 5.5 V |
| Package / Case | 8-SOIC |
| Packaging | Tape & Reel (TR) |
| Protocol | - |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP2551T I SN MCP2551TISN MCP2551T I SNTR ND MCP2551TISNTRND MCP2551T-I/SNTR |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP2551T-I/SN | - | - | - |